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COB LED EPOXY DIE BONDER
Cycle |
0.25 sec |
UPH |
14,000°³ |
BONDING ACCURACY |
¡¾30§, ¥è:¡¾3¡Æ |
BONDING METHOD |
Epoxy Bonding |
DIMENSION |
1,800(W)*1,200(L)*1,600(H) |
ƯÀÌ»çÇ× |
PCB TYPE |
UTILITY |
POWER : AC220V, 60/50 Hz
AIR : 0.4~0.6 kpa
VACUUM : -500mmHg ÀÌ»ó |
Àû¿ë PACKAGE |
CHIP SIZE : 0.2~2mm
WAFER SIZE : 6"~8" |
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