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MODEL : TIB-200L
2-HEAD EPOXY DIE BONDER (LED)

Cycle 0.3 sec
UPH 12,000°³
BONDING ACCURACY ¡¾30§­, ¥è:¡¾3¡Æ
BONDING METHOD Epoxy Bonding
DIMENSION 2,000(W)*1,000(L)*1,600(H)
ƯÀÌ»çÇ× Auto Cassette Option
UTILITY POWER : AC220V, 60/50 Hz
AIR : 0.4~0.6 kpa
VACUUM : -500mmHg ÀÌ»ó
Àû¿ë PACKAGE CHIP SIZE : 0.2~2mm
WAFER SIZE : 6"~8"