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¸ÞÀÎ > Á¦Ç°¼Ò°³ > ¹ÝµµÃ¼ |
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STEM EPOXY DIE BONDER
Cycle |
1.2 sec |
UPH |
3,000°³ ÀÌ»ó |
BONDING ACCURACY |
¡¾10§, ¥è:¡¾1¡Æ |
BONDING METHOD |
Epoxy Bonding |
DIMENSION |
1,400(W)*1,050(L)*1,650(H) |
ƯÀÌ»çÇ× |
Under CAN Type Á¦Ç°Àû¿ë |
UTILITY |
POWER : AC220V, 60/50 Hz
AIR : 0.4~0.6 kpa
VACUUM : -500mmHg ÀÌ»ó |
Àû¿ë PACKAGE |
CHIP SIZE : 0.25~1.5mm
WAFER SIZE : 6" |
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