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MODEL : TIB-510
STEM EPOXY DIE BONDER

Cycle 1.2 sec
UPH 3,000개 이상
BONDING ACCURACY ±10㎛, θ:±1°
BONDING METHOD Epoxy Bonding
DIMENSION 1,400(W)*1,050(L)*1,650(H)
특이사항 Under CAN Type 제품적용
UTILITY POWER : AC220V, 60/50 Hz
AIR : 0.4~0.6 kpa
VACUUM : -500mmHg 이상
적용 PACKAGE CHIP SIZE : 0.25~1.5mm
WAFER SIZE : 6"