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메인 > 제품소개 > 반도체 |
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STEM EPOXY DIE BONDER
| Cycle |
1.2 sec |
| UPH |
3,000개 이상 |
| BONDING ACCURACY |
±10㎛, θ:±1° |
| BONDING METHOD |
Epoxy Bonding |
| DIMENSION |
1,400(W)*1,050(L)*1,650(H) |
| 특이사항 |
Under CAN Type 제품적용 |
| UTILITY |
POWER : AC220V, 60/50 Hz
AIR : 0.4~0.6 kpa
VACUUM : -500mmHg 이상 |
| 적용 PACKAGE |
CHIP SIZE : 0.25~1.5mm
WAFER SIZE : 6" |
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