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MODEL : TIB-420
COB LED DIE BONDER

Cycle 0.3~0.8 sec
UPH 5,000~12,000개
BONDING ACCURACY ±40㎛, θ:±2°
BONDING METHOD Epoxy Multi Bonding
DIMENSION 1,800(W)*1,200(L)*1,550(H)
UTILITY POWER : AC220V, 60/50 Hz
AIR : 0.4~0.6 kpa
VACUUM : -500mmHg 이상
적용 PACKAGE PCB SIZE
- W : 50~300mm
- L : 100~600mm
- T : 0.2~2mm

CHIP SIZE : 0.3~1.2mm
WAFER SIZE : 6"~8"