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메인 > 제품소개 > 반도체 |
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COB LED DIE BONDER
| Cycle |
0.3~0.8 sec |
| UPH |
5,000~12,000개 |
| BONDING ACCURACY |
±40㎛, θ:±2° |
| BONDING METHOD |
Epoxy Multi Bonding |
| DIMENSION |
1,800(W)*1,200(L)*1,550(H) |
| UTILITY |
POWER : AC220V, 60/50 Hz
AIR : 0.4~0.6 kpa
VACUUM : -500mmHg 이상 |
| 적용 PACKAGE |
PCB SIZE
- W : 50~300mm
- L : 100~600mm
- T : 0.2~2mm
CHIP SIZE : 0.3~1.2mm
WAFER SIZE : 6"~8" |
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