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MODEL : TLB-2000
LED EPOXY DIE BONDER

Cycle 0.24 sec
UPH 15,000개
BONDING ACCURACY ±30㎛, θ:±2°
BONDING METHOD Epoxy Bonding
DIMENSION 1,420(W)*1,240(L)*1,800(H)
특이사항 DUAL STAMP EPOXY DIE BONDER
UTILITY POWER : AC220V, 60/50 Hz
AIR : 0.4~0.6 kpa
VACUUM : -500mmHg 이상
적용 PACKAGE CHIP SIZE : 0.15~0.7mm
WAFER SIZE : 4"~8"