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LED EPOXY DIE BONDER
Cycle |
0.24 sec |
UPH |
15,000°³ |
BONDING ACCURACY |
¡¾30§, ¥è:¡¾2¡Æ |
BONDING METHOD |
Epoxy Bonding |
DIMENSION |
1,420(W)*1,240(L)*1,800(H) |
ƯÀÌ»çÇ× |
DUAL STAMP EPOXY DIE BONDER |
UTILITY |
POWER : AC220V, 60/50 Hz
AIR : 0.4~0.6 kpa
VACUUM : -500mmHg ÀÌ»ó |
Àû¿ë PACKAGE |
CHIP SIZE : 0.15~0.7mm
WAFER SIZE : 4"~8" |
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