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¸ÞÀÎ > Á¦Ç°¼Ò°³ > ¹ÝµµÃ¼ |
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VERTICAL LED DIE BONDER
Cycle |
0.3 sec |
UPH |
12,000°³ |
BONDING ACCURACY |
¡¾30§, ¥è:¡¾3¡Æ |
BONDING METHOD |
Epoxy Bonding |
DIMENSION |
1,300(W)*1,000(L)*1,600(H) |
UTILITY |
POWER : AC220V, 60/50 Hz
AIR : 0.4~0.6 kpa
VACUUM : -500mmHg ÀÌ»ó |
Àû¿ë PACKAGE |
CHIP SIZE : 0.17~7mm
WAFER SIZE : 4"~6" |
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