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MODEL : TIB-210
EPOXY DIE BONDER

Cycle 0.3 sec
UPH 12,000개
BONDING ACCURACY ±30㎛, θ:±3°
BONDING METHOD Epoxy Bonding
DIMENSION 1,500(W)*1,100(L)*1,600(H)
특이사항 Single Stamp Epoxy, 다양한 L/F 적용가능
UTILITY POWER : AC220V, 60/50 Hz
AIR : 0.4~0.6 kpa
VACUUM : -500mmHg 이상
적용 PACKAGE CHIP SIZE : 0.2~2mm
WAFER SIZE : 6"~8"