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메인 > 제품소개 > 반도체 |
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EPOXY DIE BONDER
| Cycle |
0.3 sec |
| UPH |
12,000개 |
| BONDING ACCURACY |
±30㎛, θ:±3° |
| BONDING METHOD |
Epoxy Bonding |
| DIMENSION |
1,500(W)*1,100(L)*1,600(H) |
| 특이사항 |
Single Stamp Epoxy, 다양한 L/F 적용가능 |
| UTILITY |
POWER : AC220V, 60/50 Hz
AIR : 0.4~0.6 kpa
VACUUM : -500mmHg 이상 |
| 적용 PACKAGE |
CHIP SIZE : 0.2~2mm
WAFER SIZE : 6"~8" |
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